About the power bank circuit In this project, we will be making a power bank using a pre-built power bank circuit and 18650 Li-ion cells. This power bank circuit has an onboard LCD that will show you the total charge remaining, input-output voltages, and current. It has two USB ports for charging your mobile phone. […]
Are you a beginner in Electronics wondering where to start? Well, we’ve all been there once like you, swimming on the shores not knowing where to go and wondering, “What’s the difference between resistance and capacitance?†or “Who is Georg Simon Ohm and why does he have a law?â€Â  In this article, we are reviewing
UJT Characteristics The static emitter charÂacteristic (a curve showing the relation between emitter voltage VE and emitter current IE) of a UJT at a given inter base voltage VBB is shown in figure. Â From figure it is noted that for emitter potentials to the left of peak point, emitter current IE never exceeds IEo .
In this article, we learn about UJT (Uni Junction Transistor) in detail. We cover a lot about UJT like – what is basically a UJT, how they differ from other transistor models, how to construct a UJT, operation & working of a UJT, how to build applications of UJT and so much more. Lets dive
Light activated SCR (LASCR) or a Photo SCR Â is just an ordinary SCR except that it can also be light triggered. Most LASCRs also have a gate terminal for being triggered by an elecÂtrical pulse just as a conventional SCR. The basic construction of an LASCR is shown in figure. The schematic symbols most commonly
Gate turn-off switch (GTO) is, like an SCR, is a four layer, three junction semiconductor device with three external terminals, namely, the anode, the cathode and the gate, as illustrated in figure. The basic construction, schematic symbol of a GTO are shown is figures  respectively.  Although the graphic symbol is different from either the SCR
The diac and the silicon bilateral switch are grouped as bilateral or bidirectional devices because they can breakover in either direction. There are also breakover devices which breakover in only one direction; they fall in the category of unilateral or unidirectional breakover devices. Although unilateral breakover devices are more frequently employed in SCR triggering, they
Silicon bilateral switch (SBS) is another breakover device which is capable of triggering triacs, and it is popular in low-voltage trigger control circuits. They have breakover voltages lower than those for diacs, ± 8 V being the most popular rating. V-I characteristic curve of an SBS is similar to that of the diac, but it
The four-layer diode, also called the Shockley diode after its inventor William Shockley, is essentially a low-current SCR without a gate. It is classified as a diode because it has only two external terminals through anode and cathode. Because of its four doped regions it is often called a P-N-P-N diode. You can find more
Silicon controlled switch (SCS), like the SCR, is a unilateral, four layer three junction P-N-P-N silicon device with four electrodes namely cathode C, cathode gate Gx, anode gate G2 and the anode A, as shown in figure. Infact, the SCS is a low power device compared with the SCR. It handles currents in milli amperes
As mentioned earlier, low-current drop out is the normal way in which the SCR is turned off. Gate-controlled switch is designed for easy opening with a reverse-biased trigger. A gate controlled switch (GCS) is closed by a positive trigger and opened by a negative trigger (or by low-current drop out). Gate-controlled switch circuit is shown
Introduction to IGBT-Insulated Gate Bipolar Transistors Insulated gate bipolar transistor (IGBT) is a new high conductance MOS gate-controlled power switch. The fabrication process is similar to that of an N-channel power MOSFET but employs an N-epitaxial layer grown on a P+ substrate. In operation the epitaxial region is conductivity modulated (by excess holes and electrons)
Power MOSFETs are usually constructed in V-configuration, as shown in figure. That is why, the device is sometimes called the V-MOSFET or V-FET. V-shaped cut penetrates from the device surface almost to the N+ substrate through N+, P and N~ layers, as seen from figure. The N+ layers are heavily doped, low resistive material, while
Cross-view of a dual-gate N-channel depletion type MOSFET is shown in figure. It acts as if two FETs are connected in series, as is obvious from figure. The middle block acts as drain for unit no 1 and source for unit no 2. Thus the current flow through the MOSFET is controlled by the voltage
Although DE-MOSFET is useful in special applications, it does not enjoy widespread use. However, it played an important role in history because it was part of the evolution towards the E-mode MOSFET, a device that has revolutionized the electronic industry. E-MOSFET has become enormously important, in digital electronics and. In the absence of E-MOSFET’s the
We know that when the gate is biased negative with respect to the source in an N-channel JFET, the depletion region widths are increased. Theincrease in the depletion regions reduces the channel thickness, which increases its resistance. The net result is that drain current ID is reduced. If the polarity of VGG were reversed so
Introduction to MOSFET-Metal Oxide Semiconductor Field Effect Transistor, Metal-oxide-semiconductor field-effect transistor (MOSFET) is an important semiconductor device and is widely employed in many circuit applications. Since it is constructed with the gate terminal insulated from the channel, it is sometimes called insulated gate FET (IGFET). Like, a JFET, a MOSFET is also a three terminal
Unlike BJTs, thermal runaway does not occur with FETs, as already discussed in our blog. However, the wide differences in maximum and minimum transfer characteristics make ID levels unpredictable with simple fixed-gate bias voltage. To obtain reasonable limits on quiescent drain currents ID and drain-source voltage VDS, source resistor and potential divider bias techniques must
From the circuit named “looking into the drain” of the FET it is seen (for small signal operation) an equivalent circuit consisting of two generators in series, one of – u times the gate signal voltage Vin and the second (u + 1) times the source-signal voltage Vs and the resistance rd + ((a +
What is a Junction Field Effect Transistor? A JFET is a semiconductor with 3 terminals, available either in N-channel or P-channel types. It is unipolar but has similar characteristics as of its Bipolar cousins. Instead of PN junctions, a JFET uses an N-type or P-type semiconductor material between the collector and emitter (Source & Drain).
As already mentioned in Field Effect Transistors (FET) , JFET’s are of two types, namely N-channel JFETs and P-channel JFETs. Generally N-channel JFETs are more preferred than P-channel. N-channel and P-channel JFETs are shown in the figures below. Basic Construction. The structure is quite simple. In an N-channel JFET an N-type silicon bar, referred to
Introduction to FET-Field Effect Transistor So far we have discussed the circuit applications of ordinary transistors, in which both holes and electrons take part. This is the reason that these are sometimes called the bipolar transistors. Such transistors have two main drawbacks namely low input impedance because of forward biased emitter junction and considerable noise
This blog post is continuation to the original post: Fabrication techniques of a P-N junction diode 1. Grown Junction Diode: Diodes of this type are formed during the crystal pulling process. P and N-type impurities can be alternately added to the molten semiconductor material in the crucible, which results in a P-N junction, as shown
General Introduction to Fabrication techniques of a P-N junction diode: In practice, the P-N junction is formed from a single mono crystalline structure by adding carefully controlled amounts of donor and acceptor impurities. Here discussion is limited only to acquaintation with the basic techniques and terminology (not expertise in fabrication). The first and foremost requirement is
The photoconductive cell is a two terminal semiconductor device whose terminal resistance will vary (linearly) with the intensity of the inciÂdent light. For obvious reasons, it is frequently called a photoresistive device. The photoconductive materials most frequently used include cadmium sulphide (CdS) and cadmium selenide (CdSe). Both materials respond rather slowly to changes in light
